Key to Moving Forward Faster

Innovation, Processing Performance and Cooperation Key to Moving Forward Faster

INTEL DEVELOPER FORUM, April 17, 2007 - Intel Corporation executives today detailed more than 20 new products, technology innovations and industry initiatives - many of them industry firsts - aimed at making the World Wide Web, computers and consumer electronics devices much more responsive, friendlier and secure.

Under the backdrop of Intel’s leadership in 45nm Hi-k metal gate silicon technology and how it will ignite new innovation and growth opportunities, Intel executives at the Intel Developer Forum disclosed new performance details for its next-generation “Penryn” processor family. The company also unveiled two product roadmaps for Intel architecture (IA)-based System on Chip (SoC) consumer electronic (CE) devices and business uses.

“Welcome to the era of multicore, an era in which all of our computing capabilities will multiply our own personal capabilities,” said Justin R. Rattner, Intel’s chief technology officer. “This Beijing developer forum will show how our multiple innovations go hand in hand with evolutions in social networking, PC and TV entertainment, online commerce and other growing demands on the internet. Today, Intel is delivering a breadth of multicore processors worldwide and a product roadmap providing the incredible performance boost and energy efficiency needed to put the consumer more in control of the information age.”

The IDF is being held for the first time in Beijing. Last month, Intel announced plans to invest US$2.5 billion to build China’s first 300mm wafer fabrication facility in the city of Dalian.

Multicore Performance Era, Core Microarchitecture
Patrick Gelsinger, senior vice president and co-general manager of Intel Corporation's Digital Enterprise Group, provided performance indicators for Intel’s upcoming Penryn family of processors. For desktop PCs, he said to expect increases of about 15 percent for imaging-related applications; 25 percent for 3-D rendering; more than 40 percent for gaming; and more than 40 percent faster video encoding with Intel SSE4 optimised video encoders. The indicators were based on pre-production 45nm Hi-k Intel® quad core processor running at 3.33 Gigahertz (GHz) with a 1333 Megahertz (MHz) front side bus (FSB) and 12MB cache versus an Intel Core™ 2 Extreme processor QX6800 introduced last week at 2.93 GHz with 1066 FSB and 8MB cache.

For high-performance computing (HPC) and workstation systems, Gelsinger said to expect gains up to an estimated 45 percent for bandwidth intensive applications, and a 25 percent increase for servers using Java*. These indicators were derived from pre-production 45nm Hi-k Intel Xeon® processors with 1600 MHz front side bus for workstation and HPC and a 1333 MHz front side bus for servers versus today’s quad-core Intel Xeon X5355 processors.

Gelsinger said that Intel has begun planning products based on a highly parallel, IA-based programmable architecture codenamed “Larrabee.” It will be easily programmable using many existing software tools and designed to scale to trillions of floating point operations per second (Teraflops) of performance. The Larrabee architecture will include enhancements to accelerate applications such as scientific computing, recognition, mining, synthesis, visualisation, financial analytics and health applications.

The company also has plans for Intel QuickAssist Technology - a comprehensive initiative to optimise the use of accelerators in servers. Accelerators increase the performance of a single function, like security encryption or financial computation, while reducing power consumption. This initiative includes support for acceleration using IA-based multi-core processors and third party accelerators working together in Intel-based servers and developing new integrated accelerators inside the IA-based processor itself.

Gelsinger unveiled “Tolapai” plans, the first in what will be a family of enterprise-class System-on-Chip (SoC) products that integrate several key system components into a single Intel architecture-based processor. The 2008 Tolapai product is expected to reduce the chip sizes by up to 45 percent and power consumption by approximately 20 percent compared to a standard four-chip design, while improving throughput performance and processor efficiency. Tolapai will include the new Intel QuickAssist Integrated Accelerator technology.

Gelsinger also outlined product plans, including one for Intel’s high-end multi-processor servers (codenamed “Caneland”). The quad- and dual-core Intel Xeon processor 7300 series will arrive in the third quarter in 80- and 50-watt versions for blades. The new servers will complete the company’s transition to its Intel Core microarchitecture for Xeon processors. Sun Microsystems demonstrated its Solaris operating system running on an Intel Xeon 5100 series processor based system using Intel Dynamic Power technology, a new capability focused on reducing the power required for a memory subsystem.

Further bolstering PC security and manageability benefits, Intel will introduce the next-generation Intel vPro™ processor technology, codenamed “Weybridge,” in the second half of the year and using the new Intel 3 Series Chipset family, formerly codenamed “Bear Lake.”

This will follow the launch of Intel Centrino™ Pro processor technology, bringing the business-centric features of vPro systems to notebooks for the first time.

Finally, Microsoft demonstrated Windows* Server code name “Longhorn” and two complementary technologies: Windows Server Core, and its new hypervisor-based virtualisation solution, Windows Server virtualisation, running on the Intel quad-core Xeon processors. The integrated platform combination demonstrates running up to 8 core virtual machines, with “hot add” features, delivering increased efficiency and uptime for IT managers.

Home PCs, Consumer Electronics Innovation
Also at IDF, Eric Kim, senior vice president and general manager of Intel’s Digital Home Group, said Intel is focused on developing products and technologies that provide consumers with greater control, choice, clarity and community - the “4C’s” - across computers and CE platforms spanning PCs, laptops, televisions, set-top-boxes and other networked media players.

Kim detailed Intel’s strategy to deliver a common, unified IA-based processor foundation across PC and CE platforms. He said the Intel CE 2110 Media Processor, a System-on-Chip (SoC) architecture for CE devices will help manufacturers accelerate time to market for smarter,

more cost-effective designs that provide necessary performance, flexibility and headroom. Kim said the company will deliver its first CE-optimised IA-based SoC in 2008.

Intel also plans to deliver a number of desktop computer products later this year, including updates to its Intel Viiv™ processor technology roadmap and a new high-end enthusiast and gaming platform codenamed “Skulltrail.”

Future generations of Intel Viiv processor technology will be based on the Intel 3 Series Chipset family arriving this quarter and delivering improved graphics support with features such as enhanced Intel Clear Video Technology and hardware support for Microsoft* DX10 for smoother high-definition playback and 3D visuals. Intel 3 Series Chipsets also boost system performance with a faster 1333 MHz front side bus and support for DDR3 memory, PCI Express* 2.0 and Intel Turbo Memory for application acceleration and faster boot times.

Intel R&D Sets Course For Innovation
In his opening address, Rattner reiterated the company’s goals for processor performance and energy efficiency noting that Intel will be able to drive down power consumption by a factor of 10 for the ultra mobile computing segment by 2010. Intel will also create future processors at Teraflops speeds and Rattner urged the industry to work together to take advantage of this raw processing power. The next stage of Intel’s tera-scale research will be around “stacked” memory on top of the 80-core research chip Intel demonstrated earlier this year.

About Intel
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom.

ENDS

For more information, please contact:
Anna Torres, Intel Australia Pty. Ltd, Tel: +61 2 9937 5944,
Email: anna.torres@intel.com
Sally Raudon, Botica Butler Raudon Partners, Tel: +64 9 303 3862,
Email: sallyr@botica.co.nz

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others.

Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. For more information on performance tests and on the performance of Intel products, visit .

intel DEVELOPER FORUM Day 1 news disclosures FROM beijing

April 17, 2007: Below are some news highlights during the Intel Developer Forum’s first day.

Patrick Gelsinger, “Instilling Energy Into the Enterprise”
Intel Senior Vice President; General Manager, Digital Enterprise Group
Gelsinger updated attendees on all aspects of the enterprise, from small offices to the most powerful high-performance computing areas. He provided a number of new and unique disclosures, more information on the company’s upcoming next-generation 45 nanometer (nm) processor families, “Penryn” and “Nehalem.” These are the next steps in Intel’s “tick-tock” product strategy and cadence to deliver a new process technology with an enhanced microarchitecture or entirely new microarchitecture every year.

Early Penryn Performance - For Penryn-based desktop PCs, expect increases of about 15 percent for imaging-related applications; 25 percent for 3-D rendering; more than 40 percent for gaming; and more than 40 percent faster video encoding with Intel SSE4 optimised video encoders. These indicators were based on pre-production 45nm Hi-k Intel® quad core processor running at 3.33 Gigahertz with a 1333 front side bus and 12MB cache versus an Intel Core™ 2 Extreme processor QX6800 introduced last week at 2.93 GHz with 1066 FSB and 8MB cache. For high-performance computing (HPC) and workstation systems, expect performance gains up to an estimated 45 percent for bandwidth intensive applications; and a 25 percent increase for servers using Java*. The indicators were derived from pre-production 45nm Hi-k Intel Xeon® processors with 1600 MHz front side bus for workstation and HPC, and a 1333 MHz front side bus for server versus current quad-core Intel Xeon X5355 processors.

Microsoft Longhorn Demo - Microsoft demonstrated Windows* Server codename “Longhorn” and two technologies: Windows Server Core and its new hypervisor-based virtualisation solution, Windows Server virtualisation, running on the Intel quad-core Xeon processors. This translates to running up to 8 core virtual machines with “hot add” features, increasing data center uptime and efficiency.

“MP” Server Processors on Deck - Intel’s high-end quad and dual multi-processor servers (codenamed “Caneland”) and branded Intel Xeon processor 7300 series will arrive in the third quarter in 80 and 50 watt versions for blades. The new servers will complete the transition to its Intel Core microarchitecture for Intel Xeon processor-based servers. Just three months after announcing a joint effort Sun Microsystems, a Sun executive demonstrated its Solaris operating system running on an Intel Xeon 5100 series processor based system using Intel Dynamic Power technology

vPro Technology Coming in Second Half - In the second half of the year, Intel will introduce “Weybridge,” the next-generation vPro processor technology for business PCs using Intel 3-Series chipsets (codenamed “Bear Lake”). As announced 2 weeks ago, Intel’s forthcoming Centrino platform, due later this quarter, will also incorporate vPro technology for the first time in laptops.

System on Chip Plans, Enterprise - Gelsinger unveiled “Tolapai” plans, the first in what will be a family of enterprise-class system-on-chip (SoC) products that integrate several key system components into a single Intel architecture-based processor. The 2008 Tolapai product is expected to reduce the chip footprint size by up to 45 percent and power consumption by approximately 20 percent compared to a standard four-chip design, while improving throughput performance and processor efficiency. Tolapai will include the new Intel QuickAssist Integrated Accelerator technology.

Intel QuickAssist Technology - Intel QuickAssist Technology is a comprehensive initiative to optimise the use of accelerators in servers. Accelerators increase the performance of a single function, like security encryption or financial computation, while reducing power consumption. This initiative includes support for acceleration using IA-based multi-core processors and third party accelerators working together in Intel-based servers, and developing new integrated accelerators inside the IA-based processor itself. The approach includes a software layer (Accelerator Abstraction Layer) that allows applications to easily manage accelerators and protect software investment.

Nehalem Processor Family - After Intel’s Penryn processors, Intel will begin manufacturing the Nehalem processor family in 2008. Among many other features, the processors will have from 1-8+ cores per product, and include simultaneous multi-threading to show 2-16 threads per chip. Certain future Nehalem processors will also include options such as system interconnects and integrated memory controllers and high-performance integrated graphics engine.

Project Larrabee - Intel has begun planning products based on a highly parallel, IA-based programmable architecture codenamed “Larrabee.” It will be easily programmable using many existing software tools, and designed to scale to trillions of floating point operations per second (Teraflops) of performance. The Larrabee architecture will include enhancements to accelerate applications such as scientific computing, recognition, mining, synthesis, visualisation, financial analytics and health applications.

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Eric Kim, “Winning the Connected Home”
Intel Senior Vice President; General Manager, Digital Home Group
Kim said that technology innovation and broadband Internet growth are having profound effects on digital entertainment and that Internet video is the next powerful, disruptive opportunity. He shared how Intel is developing PC and CE-based products and technologies to enable new broadcast and broadband-based information and video entertainment experiences that provide consumers with better control, choice, clarity and community (the “4C’s”) within the home, spanning PCs, TVs, set-top-boxes and other networked media players. A unified Intel architecture (IA)-based foundation across PC and CE platforms will help further bridge the PC, Internet and living room TV experiences.

Next Generation Chipsets, Processors, Software and Intel Viiv™ Processor Technology:

o Performance and Graphics - The Intel 3 Series chipsets (“Bear Lake”) will arrive this quarter, providing consumers with enhanced Intel Clear Video Technology and hardware support for Microsoft* DX10. Intel 3 Series Chipsets also boost performance with a faster 1333 MHz front side bus and DDR3 support, PCI Express* 2.0 and Intel Turbo Memory for faster application loading and boot times. Intel Viiv processor technology codenamed “Salt Creek,” will use versions of these chipsets and arrive in the second half of the year.

o Smaller, Sleeker Designs - This quarter, Intel will extend its next-generation mobile technology into smaller, cooler and quieter PC designs. Among other features, “Santa Rosa on Desktop” will provide integrated 802.11n wireless support and include Intel Turbo Memory.

o New Desktop to Laptop Media Sharing - Available this quarter, Intel Media Share Software allows consumers to browse, stream or download media files from Intel Viiv processor technology-based PCs onto their Centrino® Duo-based laptops via a wireless home network.

• PC Style Award Winner Announced - Congratulations to $1 Million Intel Core Processor Challenge grand prize winner TriGem Computer Inc. (Korea) and first runner-up Mesiro (Norway).

• SoC For CE - Intel will deliver IA-based system-on-chip (SoC) products for a new generation of Internet compatible consumer electronics (CE) devices, such as digital set top boxes, TVs and networked media players. This SoC approach will help manufacturers accelerate time to market and develop more cost-effective designs that provide strong processing performance, flexibility and headroom. Intel’s first CE-optimised IA-based SoC is scheduled for 2008, pairing a powerful IA core with leading-edge A/V processing, graphics and more to help deliver greater performance, full Internet compatibility and a more cohesive software ecosystem across a number of devices.

• Intel SoC Media Processor - Intel introduced a highly integrated SoC product for CE devices: the Intel CE 2110 Media Processor powered by a 1GHz XScale® processing core and includes powerful audio-visual capabilities. (Note - separate press release exists.)

• “Skulltrail” - Building on last week’s launch of the Intel Core 2 Extreme processor QX6800, a new dual processor-based platform for later this year will arrive, codenamed “Skulltrail.” It will feature two sockets for quad core processors and four PCI express slots for advanced graphics and allow enthusiasts to take advantage of the Intel Core microarchitecture’s headroom and scaling.

• Home Manageability Feature for PCs - Building from technology in the Intel vPro processor technology, Intel plans to offer an optional home manageability feature in future roadmaps that would allow systems to be managed, repaired and updated remotely. Consumers would have an opt-in/out consent feature, as well as the ability to watch and access audit logs of what was performed.

• Standards for Home Networking - Intel plans to include Home Plug technology as an optional feature on 2008 desktop platforms. The company also advocated the need for improved device-to-device connectivity and displayed an Ultra Wide Band mini-card solution. Kim also talked about Intel’s involvement in other key organisations, including the Digital Living Network Alliance.

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Justin R. Rattner, “Power Your Innovations”
Intel Chief Technology Officer and Senior Fellow; Director, Corporate Technology Group
Rattner's opening keynote provided an overview of Intel’s corporate vision and strategy. He pointed to the significance of hosting the first IDF of 2007 in Beijing and covered a broad range of topics.

10X Power Reduction Coming - Rattner pointed to specific goals and timelines to drive down power-consumption and manufacturing die-size to get to processors for ultra mobile computer usage. By the end of the decade, Intel aims to achieve a 10x reduction in power-consumption in its processor portfolio.

Ongoing Teraflops Research - As a follow-up to the recently unveiled 80-core Teraflops research chip, Rattner pointed to pending results on a stacked memory solution - and also demonstrated for the first time this single-piece of programmable silicon reaching 2 Teraflops speed.

ENDS

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