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Core Microarchitecture Processor Line-Up Expands

Published: Tue 5 Dec 2006 10:39 AM
Intel Core Microarchitecture-Based Processor Line-Up Expands to Communications Solutions
From ITU Telecom World, Hong Kong, Intel Corporation announced building blocks for communication servers that deliver enhanced performance, value and choice for telecommunications equipment manufacturers and computing tasks such as call control, mobile location services and subscriber billing.
The Intel® NetStructure® MPCBL0050 Single Board Computer is the first AdvancedTCA* (ATCA) blade server based on the Intel Core™ microarchitecture. Also unveiled today were the new power-efficient Dual-Core Intel Xeon® processor LV 5138 and LV 5128. These new products are well suited for compute-intensive and space-constrained environments such as telecommunications central offices and datacentres. The fourth product announced is the Intel Carrier Grade Server TIGW1U, powered by previously launched Dual-Core Intel Xeon processor LV 5148, which offers customers high performance per watt in a small ruggedised form factor.
“Today’s new products, based on the revolutionary Intel Core microarchitecture, expands the Intel portfolio of modular communications building blocks and turbo charges Moore’s Law for communications,” said Anthony Ambrose, general manager, Intel Modular Communications Platform Division. “Intel now offers the broadest choice of high-performance, standards-based building blocks for communication servers with the price and feature flexibility equipment manufacturers require.”
The Intel NetStructure MPCBL0050 blade server, powered by the new Dual-Core Intel Xeon processor LV 5138, delivers almost three times the performance per slot of the leading competitive blade server, which enables service providers to deliver new, revenue-generating services with fewer blades. It runs Carrier Grade Linux* operating system and offers significant performance improvements for compute-intensive and database-access applications, including IP Multimedia Subsystems (IMS), wireless control plane and IPTV. Additionally, it is designed to be the first blade server to comply with the proposed Communications Platforms Trade Association (CP-TA) 1.0 standard to improve industry interoperability.
The Dual-Core Intel Xeon processor LV 5138 and 5128 combine the benefits of a dual-core processing with dual-processor capabilities, providing four high-performance cores on a single platform. The LV 5138 offers telecommunication customers robust thermal profiles and a low Thermal Design Power (TDP) for solutions that require compliance with ATCA form factor and NEBS Level-3 thermal specifications.
“HP works closely with Intel to incorporate the latest high-performance ATCA processor blade technology into comprehensive solutions that include hardware, software and worldwide services and support,” said Stephen Low, marketing director, carrier grade platforms, Business Critical Systems, HP. “With solutions based on ATCA blade servers such as the HP bh5700 series, HP can give its customers a time-to-market advantage.”
“Motorola is committed to adopting multi-core technology such as the Intel NetStructure MPCBL0050 Single Board Computer in our Centellis™ and Avantellis™ series AdvancedTCA* servers as it will enable us to deliver more cost-effective and energy-efficient solutions to meet network equipment provider requirements for compute-intensive applications,” said Wade Campbell, senior director, Strategic Marketing for Motorola’s Embedded Communications Computing business. “We believe this technology will allow us to increase the capacity on existing applications and will enable our industry-leading communications servers to address a broader range of next-generation applications.”
The Intel NetStructure MPCBL0050 Single Board Computer will cost US$5,169 and the Intel Carrier Grade Server TIGW1U starts at US$1,550. Both products will be available in the first quarter of 2007. The Dual-Core Intel Xeon processor LV 5138 and LV 5128 will cost US$617 and US$412, respectively, per 1,000 units, and will begin shipping in the fourth quarter of this year.
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom.
Intel, Intel NetStructure, Intel Xeon, Intel Core and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others.
Copyright © 2006 Intel Corporation. All rights reserved.
ENDS

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