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Intel Executives Outline Imperatives

Published: Fri 10 Sep 2004 09:39 AM
9 September 2004
Intel Executives Outline Imperatives For All-Day Mobile Computing
Intel Corporation executives today outlined four imperatives for bringing all-day, anytime and anywhere wireless mobile PC computing closer to reality. These imperatives include new mobile PC platform capabilities, industry collaboration to drive all-day battery life, optimising software applications for mobile computing, and the evolution of one smart, mobile, modular networking infrastructure.
Intel also unveiled new details of forthcoming Intel® Centrino™ mobile technology products, including its Sonoma platform and next generation platform, codenamed “Napa.”
Available early next year, Sonoma will deliver Intel’s best solution for entertainment on-the-go in notebooks and adheres to the company’s Intel Stable Image Platform Program, designed to help corporations manage their computer software image transitions. Sonoma will include a new Intel Pentium® M processor with a faster, 533 MHz front-side bus and a chipset code-named “Alviso,” along with the newly released Intel PRO/Wireless 2915ABG network connection.
Sonoma will be followed by the “Napa” platform, which will include a new dual core mobile processor, codenamed “Yonah,” based on Intel’s 65 nm process technology. The platform will also include a new integrated graphics chipset codenamed “Calistoga,” and next generation Intel wireless solution codenamed “Golan.”
Industry Collaboration to Resolve Battery Life Challenges Adding new functions and capabilities to mobile platforms taxes battery life and can limit notebook designs. Intel is working to reverse this trend by developing power state management techniques and new battery technologies essential to extending laptop battery life and keeping form factors small and light-weight.
“Let’s not forget that to be truly mobile, we have to focus on removing plugs too, and Intel is working with the industry on a platform approach to achieve the goal of eight-hour battery life by 2010,” said Anand Chandrasekher, vice president and general manager of Intel’s Mobile Platforms Group. “The industry is already addressing some of these challenges via the Mobile PC Extended Battery Life Working Group and today’s release of ACPI specification v.3.0, but further industry cooperation and work is needed.”
Intel also introduced the Intel Battery Life Optimisation Program to help resolve some of the power management and platform configuration hurdles to achieving all-day battery life. The company will work with original equipment manufacturers (OEMs) and original design manufacturers (ODMs) to provide technical guidance on power delivery and power management architecture. Intel will also develop guidelines for optimising power saving features using Intel hardware and software ingredients that OEMs/ODMs can design-in for greater battery life gains.
All Software Mobile Optimised Intel’s mobilised platform effort allows end users to fully take advantage of their mobile life and work styles. Today, more than 250 software applications have been mobile optimised including major enterprise applications such as SAP*, PeopleSoft*, SAS* and UGS-PLM*.
Chandrasekher highlighted Intel’s enabling efforts to make wireless LAN as secure as wired networks, including details of the upcoming Intel Secure OnConnect Authentication Guide. The Intel Secure OnConnect Authentication Guide outlines how to apply enhanced 802.1x and Extensible Authentication Protocol (EAP) technologies to achieve device authentication and enforce security compliance to reduce threats to wired and wireless networks.
One Network: Modular Innovation Howard Bubb, Intel vice president and general manager of Intel’s Communications Infrastructure Group, described how the communications infrastructure will develop to support growing demand for innovative multi-media services such as VoIP, Video On Demand, and real-time gaming.
“Over the next decade, we see the network evolving to one network architecture based on standard building blocks, protocols, and application frameworks – a network that is modular, untethered, all-broadband and packet-based, which will deliver multi-media services to a variety of smart, mobile clients,” said Bubb. “Intel is playing a major role by delivering the modular building blocks enabling this transformation, and by driving adoption of standards such as Carrier Grade Linux and AdvancedTCA™.”
Intel is also driving progress in the rapidly growing wireless ecosystem. As wireless services have become more and more prevalent in our lives, service providers continue to look to new technologies such as WiMAX to build out wireless broadband networks and look to Intel for the latest improvements in ease-of-use and technologies.
Intel also detailed its latest products for wireless access including a complete roadmap of integrated processors for the smart handheld client space, and a new chipset codenamed “Rosedale” for designing cost-effective WiMAX subscriber stations and residential gateways.
Separately, Bubb unveiled Intel’s 1/10 Gigabit Ethernet switching technology based on 90 nm process technology. Codenamed “Capilano,” the switch-on-a-chip integrates multiple 1 and 10 GbE ports, address and packet buffer memory, and high performance interfaces such as SERDES (Serialiser/Deserialiser) and XAUI (Attachment Unit Interface). Capilano is the first in a series of Intel Ethernet switching solutions aimed at accelerating adoption of 10GbE technologies.
About IDF The Intel Developer Forum is the technology industry’s premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF, visit http://developer.intel.com/idf/. Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.
Intel and Intel Centrino are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others.
AdvancedTCA is a registered trademark of the PCI Industrial Computers Manufacturers Group.
ENDS

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