News Release
Intel Working To Get The Lead Out
Company Reduces Overall Use of Lead in its Logic Chips by 95 Percent
Intel today announced at its Intel Developer Forum (Tokyo - Japan) that it will begin eliminating approximately 95
percent of the lead used in its processors and chipsets starting later this year. The company is taking these
significant steps to remove lead from its product packaging in order to make it more environmentally friendly.
Intel will begin shipping the lead-free technology with select microprocessors and chipsets in Q3, 2004, and
embedded IA processors in Q2, 2004. The company shipped its first lead-free memory chips last year. Additional products
will be transitioned as manufacturers become able to handle them. The new packages use lead-free solder balls, about the
size of salt crystals, and represent the majority of lead used in Intel microprocessor packaging. Intel is working with
the industry to find a reliable solution for the tiny amount of lead still needed inside the processor packaging to
connect the actual silicon “core” to the package.
The transition to lead-free is a massive industry-wide effort with many technological, logistical and economic
challenges. Since 2000, Intel has been working with industry consortia to come up with solutions that can be used around
the world. To achieve this, the company developed reference procedures on its own research assembly lines to aide our
customers implement lead-free technology in their manufacturing process. And, will continue to ship lead/tin versions of
these products during the transition period for system manufacturers who need time to develop and qualify their
lead-free processes and products.
“Intel shipped millions of lead-free Flash Memory components in 2003. Today’s announcement is the next major step on the
road to a lead-free product line for Intel’s high volume CPU and chipset product lines,” said Nasser Grayeli, Intel vice
president and director of assembly technology development, Technology and Manufacturing Group. “Our goal has been to
develop a total solution that addresses the needs and concerns of our customers and suppliers, from the package
materials to motherboard manufacturing. By doing this, our customers will be able to launch platforms with the new
lead-free technology in the second half of 2004.”
Getting the Lead Out
Lead has been used in electronics for more than one hundred years because of its electrical and mechanical properties.
It has been a scientific and technical challenge for industry researchers to develop new materials that meet the
performance and reliability requirements for the different ways lead is used in components, products, and assembly
processes. At the same time, various national bodies around the world have been working to reduce or eliminate lead and
therefore the danger it represents to the environment and general health.
Intel qualified its first lead-free Plastic Ball Grid Array package in 2001 for use with its Flash memory, and shipped
its first lead-free product in 2002. The lead/tin solder previously used for connecting this package to the motherboard
was replaced with a tin/silver/copper alloy. This work allowed Intel and its customers to gain valuable insight about
what was required both technologically and logistically to make the transition to lead-free technology.
Intel’s new Flip Chip Ball Grid Array package also uses a tin/silver/copper alloy to connect the chip package to the
motherboard. However, until Intel and the industry can certify a replacement that meets performance and reliability
requirements, a tiny of amount of lead/tin (about .02 grams) is still used inside the sealed package to attach the
silicon core to the package.
Helping Customers Make the Transition
Intel used its assembly development lines in Arizona and Oregon, and Malaysia facilities to perfect both flip chip
packages and printed circuit board assembly (PCA). The new lead-free compatible materials and assembly processes were
documented as reference processes for distribution to customers and system manufacturers. This gave customers a
reference point to start redesigning their own printed circuit board assembly processes and bring them into alignment
with the lead-free solution.
About IDF
The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held
worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products
for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology,
visit http://developer.intel.com.
Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications
products. Additional information about Intel is available at www.intel.com/pressroom.
Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other
countries.
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