Intel Creates Technology To Enable ‘Wireless-Internet-On-A-Chip’
Cell Phone and Handheld Computer Features Combined on a Single Chip
for More Powerful, Energy-Efficient Wireless Internet Devices
Intel Corporation today unveiled an experimental computer chip based on a new process technology that combines the core
components of today’s cellular phones and handheld computers. This integrated, “wireless-Internet-on-a-chip” technology
could enable a new era of wireless Internet-access products with extensive battery life and greater processing power.
The new research chips feature logic (microprocessor), flash memory and analog communications circuits on a single piece
of silicon built using a single manufacturing process. Each of these types of circuits is traditionally manufactured on
separate process technologies in different factories.
Chips produced on the new process may be up to five times more powerful than those used in today’s cell phones, capable
of operating at speeds of up to 1 GHz and providing up to a month of battery life. Intel engineers expect that the
technology will make possible a broad range of wireless devices and a host of futuristic applications that are only
imagined today.
“The wireless-Internet-on-a-chip technology extends Intel’s existing logic and flash silicon technology leadership,”
said Sunlin Chou, senior vice president and general manager of Intel’s Technology and Manufacturing Group. “By carefully
merging Intel’s low-power, high-performance logic technology with Intel’s high-density flash memory technology and
adding precision analog elements, we are able to cost effectively integrate all the key silicon technology elements
required for the next generation of wireless devices — without compromising performance or density.”
Said Ron Smith, senior vice president and general manager of Intel’s Wireless Computing and Communications Group: “In
the last 10 years of mobile device evolution, we have seen integration technology add significant functionality and
battery life while reducing size and cost to users. We believe Intel’s new process technology will extend this trend.
Within the next five to 10 years, we should not be surprised to see devices such as wearable computers or even video
watch phones become widely available.”
Sophisticated Process Technology Responsible for Integration Advancements
In architecting this technology, Intel engineers were able to overcome the complexities associated with the
traditionally separate optimization paths for flash, logic and analog manufacturing processes. Now, instead of three
separate manufacturing processes to produce three separate chips, the wireless-Internet-on-a-chip technology utilizes
one process to place all three functions onto one chip.
This new process technology has been engineered in a modular fashion, providing a platform to enable future wireless
products to combine flash, logic or analog functions in a variety of combinations. This allows Intel the unique ability
to respond to the evolving wireless market with a wide variety of leadership product offerings, all built from the same
silicon technology base.